What is HTCC (High Temperature Co-fired Ceramic) Technology？

In this era of rapid technological development, various new technologies emerge in an endless stream. Among them, HTCC high temperature co-fired ceramic technology has become the focus of attention due to its unique advantages and broad application prospects. Today, let us unveil the mystery of HTCC high temperature co-fired ceramic technology and explore its secrets.

1. HTCC Technology Overview

HTCC (High-temperature Co-fired Ceramics) is a high-temperature co-fired ceramic technology, mainly used to manufacture ceramic components with electrical interconnection characteristics. HTCC is sintered with metals with higher melting points in a high-temperature environment above 1450°C. Usually, the binder is first removed below 900°C, and then the multi-layer laminated ceramics are co-fired into one piece in a high-temperature environment of 1500-1800°C. The HTCC circuit process is made by screen printing, and the selected conductor material is generally a metal with a higher melting point such as tungsten, molybdenum, manganese, etc.

High temperature co-fired ceramics are ceramic powders mixed with solvents, binders, dispersants, plasticizers and other additives into slurry, and then the green ceramic tape is obtained by tape casting technology. It is cut into fixed-size diaphragms and then laser punched. The tungsten, molybdenum, molybdenum-manganese and other metals are used for filling holes and circuit design in each layer by screen printing technology. The green body is then stacked, pressed, and cut, and sintered in a wet N2/H2 atmosphere at 1500~1850°C. Finally, vertical interconnection between different layers is achieved to complete the connection between metal and ceramic. The product process flow of HTCC technology is diverse, and there will be certain differences in the process according to the needs of different types of downstream products. At present, HTCC technology is widely used in ceramic packaging, heating elements, sensors and other fields.

2. HTCC technology has the following characteristics:

1. High reliability: Products made with HTCC technology have extremely high structural strength and thermal stability, and can maintain stable performance in harsh environments.

2. High integration: Multi-layer ceramic housing and diversified packaging forms enable HTCC technology to meet the needs of modern electronic devices for miniaturization and high integration.

3. High efficiency and energy saving: HTCC heating elements are highly efficient and energy-saving. Compared with traditional electric heating elements, they can save a lot of electricity under the same heating effect.

‌4. Environmental protection and safety‌: HTCC ceramic materials do not contain harmful substances such as lead, cadmium, mercury, etc., fully meet environmental protection requirements, and contribute to green technology .

‌3. Application of HTCC technology

1. Electronic packaging: HTCC technology is widely used in the field of electronic packaging, especially in high-power electron tubes, vacuum tube switches, chip packaging, etc. Its high dielectric properties, low loss characteristics and thermal expansion coefficient close to that of silicon wafers make HTCC ceramic packaging the first choice for high-end packaging materials.

2. Heating element : HTCC heating element is a new type of environmentally friendly, efficient and energy-saving ceramic heating element that generates heat after power is turned on by printing high-melting-point metal resistance paste such as tungsten, molybdenum, and manganese on a ceramic sheet, forming a loop through pins and circuits, and generating heat. It is also called MCH heating sheet. HTCC heating element solves the shortcomings of ordinary electric heating wires or PTC heating wires, such as high power but low heating efficiency, large heat loss, and difficult insulation to meet standards. It can be used in various heating fields, such as heaters, dryers, warm air air conditioners, humidifiers, electronic cigarettes, etc.

3.Sensor manufacturing: HTCC ceramics can be used in a variety of sensors, such as oxygen sensors, displacement sensors, pressure sensors, etc. Among them, the oxygen sensor obtained by high-temperature co-firing of platinum and ceramics is an essential component for three-way catalytic conversion of electronic fuel injection vehicles.

4. Future Prospects of HTCC Technology

With the advent of the era of electronic device integration, the demand for miniaturization, high density, multifunctionality, high reliability and high power of electronic devices is increasing. HTCC technology, with its unique advantages, has shown great potential in meeting these needs. In the future, with the continuous advancement of material science, manufacturing processes and design technologies, HTCC high temperature co-fired ceramic technology is expected to achieve breakthroughs and expand applications in more fields .

As an outstanding representative of modern science and technology, HTCC high temperature co-fired ceramic technology is leading the trend of scientific and technological development with its excellent performance and broad application prospects. Let us look forward to HTCC technology creating more miracles in the future and bringing more benefits to human society!